Transient thermal management in electronic packaging using dynamic control of power dissipation and heat transfer

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 205-211

  Cao, L ^a   Krusius, J P ^a   Korhonen, M ^a   Fisher, T ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT TRANSFER; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; POWER CONTROL; RELIABILITY; THERMAL VARIABLES CONTROL; TRANSIENTS;

HEAT TRANSFER CONTROL; POWER DISSIPATION CONTROL; QUEUEING SIMULATION; TRANSIENT THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0029695973     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)