Palletized approach to large-area thin-film processing-materials, modeling, and measurement

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 686-693

  Variyam, Manjula N ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINA; CERAMIC MATERIALS; COPPER; DENSITY (OPTICAL); DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; OPTICAL INTERCONNECTS; VISCOELASTICITY;

ELECTRONIC PACKAGING INDUSTRY; HIGH DENSITY INTERCONNECT STRUCTURES; PALLETIZATION; SILICON TILES; THIN FILM PROCESSING; WARPAGE;

THIN FILMS;

EID: 0032690784     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)