Analysis of thermal warpage in a PCB with an array of PTH connectors

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 3, 1999, Pages 414-420

  Djurovic, Boris ^a   Puzzo, Carmine A ^b   Spelt, Jan K ^c  

^a ATOMIC ENERGY OF CANADA LIMITED   (Canada)

^b Celestica Inc   (Canada)

^c UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRIC CONNECTORS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PRINTED CIRCUIT MANUFACTURE; SOLDERING; THERMAL EXPANSION;

PIN-THROUGH-HOLE (PTH) CONNECTORS; WARPAGE;

PRINTED CIRCUIT BOARDS;

EID: 0033347718     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.796544     Document Type: Article

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