Microstructure and mechanical properties of transient liquid phase bonds between NiAl and a nickel-base superalloy

Journal of Materials Science

Volumn 34, Issue 5, 1999, Pages 1061-1071

  Gale, W F ^a   Guan, Y ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BAND STRUCTURE; CARBIDES; CHROMIUM; COPPER; EPITAXIAL GROWTH; LIQUIDS; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; NICKEL ALLOYS; SHEAR STRESS; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

COPPER INTERLAYER; NICKEL BASED SUPERALLOY; TRANSIENT LIQUID PHASE;

NICKEL COMPOUNDS;

EID: 0032686612     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004504330294     Document Type: Article

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