Reliability of postmolded IC packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 115, Issue 4, 1993, Pages 346-355

  Nguyen, L T ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CORROSION; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; IMPURITIES; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); MOISTURE; SEMICONDUCTOR DEVICE STRUCTURES; STRESS ANALYSIS;

INTERFACIAL ADHESION; MOISTURE INDUCED CORROSION; MOISTURE PERMEATION; MOLDING STRESSES; OUTGASSING IMPURITIES; POSTMOLDED INTEGRATED CIRCUIT PACKAGES;

ELECTRONICS PACKAGING;

EID: 0027813193     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2909343     Document Type: Article

References (52)

1. Robock, P. V., and Nguyen, L. T., “Plastic Packaging,” Chapter 8, Microelectronics Packaging Handbook, R. R. Tummala and E. J. Rymaszewski, eds., Van Nostrand Reinhold, New York, 1989.
2. Nguyen, L. T., Danker, A., Santhiran, N., and Shervin, C. R., “Flow Modeling of Wire Sweep during Molding of Integrated Circuits,” ASME Winter Annual Meeting, 27, November 8-13, Anaheim, CA, 1992; L. T. Nguyen and F. J. Lim, “Wire Sweep during Molding of Integrated Circuits,” 777, Electronic Components and Technology Conf, Las Vegas, NV, May 20-23, (1990); F. J. Lim and L. T. Nguyen, “Pressure and Temperature Measurement during the Filling Stage of the Transfer Molding Process,” MEPPE FOCUS’91, 246, January 15-17, Santa Clara, CA(1991); L.T. Nguyen, “Wire Sweep in Transfer Molding,” 2nd Ann. Symposium on Current Issues in Microelectronic Packaging, San Jose State University, May 29-30, 1991.
3. Nguyen, L. T., Walberg, R. L., and Chua, C. K., “Voids in IC Plastic Packages from Molding,” ASME/JSME Conf. on Electronic Packaging, 751, San Jose, CA, April 9-12, 1992.
4. Dale, J. R., and Oldfield, R. C., “Mechanical Stresses Likely to be Encountered in the Manufacture and Use of Plastically Encapsulated Devices,” Microelectronics and Reliability, Vol. 16, 1977, p. 255.
5. Nguyen, L. T., and Noyan, I. C., “X-ray Determination of Encapsulation Stresses on Silicon Wafers,” Polym. Eng. Sci., Vol. 28, 1988, p. 1013.
6. Schroen, W. H., Spencer, J. L., Bryan, J. A., Cleveland, R. D., Metzgar, T. D., and Edwards, D. R., “Reliability Tests and Stress in Plastic Integrated Circuits,” Int. Reliability Physics Symp., 81, Orlando, FL, April 7-9, 1981.
7. Edwards, D. R., Heinen, G., Bednarz, G. A., and Schroen, W. H., “Test Structure Methodology of IC Package Material Characterization,” Electronic Components Conf., 386, May 16-18, Orlando, FL, 1983.
8. Liechti, K., and Theobald, P., “The Determination of Fabrication Stresses in Microelectronic Devices,” Electronic Components Conf, 203, May 14-16, New Orleans, LA, 1984.
9. Lundstrom, P., and Kare Gustafsson, “Mechanical Stress and Life For Plastic-Encapsulated Large-Area Chip,” 396, Electronic Components Conf, Los Angeles, CA, May 8-11, 1988.
10. Gee, S. A., Bogert, W. F. v. d., Akylas, V. R., and Shelton, R. T., “Strain Gage Mapping of Die Surface Stresses,” Electronic Components Conf, 343, Houston, TX, May 22-24, 1989.
11. Nguyen, L. T., Gee, S. A., and Bogert, W. F. V. D., “Effects of Configuration on Plastic Package Stresses,” ASME Journal of Electronic Packaging, Vol. 113, 1991.
12. Beaty, R. E., Suhling, J. C., Moody, C. A., Bittle, D. A., Johnson, R. W., Butler, R. D., and Jaeger, R. C., “Calibration Considerations for Piezo-resistive-Based Stress Sensors,” Electronic Components and Technology Conf., 797, Las Vegas, NV, May 20-23, 1990.
13. Michael, M., “Design Guidelines,—A1 Metallization in Plastic Encapsulated Semiconductor Devices,” MEPPE FOCUS’91, 172, January 15-17, Santa Clara, CA, 1991.
14. Michael, M., “Stress Analysis for Large Die Plastic Packages,” NEPCON East Conf, June 10-13, Boston, MA, 1991.
15. Takeuchi, E., Takeda, T., and Hirano, T., “Effect of Combination Between Various Polyimide Coating Materials and Molding Compounds on the Reliability of Integrated Circuits,” Electronic Components and Technology Conf, 818, Las Vagas, NV, May 20-23, 1990.
16. Khan, M. M., Tarter, T. S., and Fatemi, H., “Stress Relief in Plastic-Encapsulated Integrated Circuit Devices by Die Coating with Photodefinable Polyimide,” Electronic Components and Technology Conf., 425, Los Angeles, CA, May 8-11, 1988.
17. Cagan, M., and Ridley, D., “A Photo-patternable Stress Relief Material for Plastic Packaged Integrated Circuits,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. 11, 1988, p. 641.
18. Oizumi, S., Imamura, N., Tabata, H., and Suzuki, H., “Stress Analysis of Si-Chip and Plastic Encapsulant Interface,” Nitto Tech. Reports, 51, 1987.
19. Doorselaer, K. V. and de Zeeuw, K., “Relation Between Delamination and Temperature-Cycling Induced Failures in Plastic Packaged Devices,” Electronic Components and Technology Conf., 813, Las Vegas, NV, May 20-23, 1990.
20. Lesk, L. A., Thomas, R. E., Hawkins, G., Remmel, T. P., and Rugg, J., “Progression of Damage Caused by Temperature Cycling on a Large Die in a Molded Plastic Package,” Electronic Components and Technology Conf., 807, Las Vegas, NV, May 20-23, 1990.
21. Chen, A. S., Nguyen, L. T., and Gee, S. A., “Effect of Material Interactions during Thermal Shock Testing on IC Package Reliability,” Electronic Components and Technology Conf., 693, Lake Buena Vista (Orlando), FL, June 1-3, 1993.
22. Bogert, W. F. V. D., Belton, D. J., Molter, M. J., Soane, D. S., and Biernath, R. W., “Thermal Stress in Semiconductor Encapsulating Materials,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. 11, 1988, p. 245.
23. Nguyen, L. T., “On Lead Finger Designs in Plastic Packages for Enhanced Pull Strengths,” Int. J. Microcircuits and Electronic Packaging, II, Vol. 15, no. 1, 1992.
24. Nguyen, L. T., “Surface Sensors for Moisture and Stress Studies,” Chapter 8, New Characterization Techniques for Thin Polymer Films, H-M Tong, and L. T. Nguyen, eds., John Wiley Sons, 1990.
25. de Cataldis, C., Tessieri, R., Apicella, A., and Carfagna, C., “The Role of the Diffusion Controlled Curing of an Amino Hardened Epoxy,” Interrelations Between Processing Structure and Properties of Polymeric Materials, J. C. Seferis and P. S. Theocaris, eds., 1984, p. 605.
26. Belton, D. J., Sullivan, E. A., and Molter, M. J., “Moisture Transport Phenomena in Epoxies for Microelectronic Applications,” Chapter 25, ACS Symp. Vol. 407, 1989, p. 286.
27. Davidson, T. M., and Senturia, S. D., “The Moisture Dependence of the Electrical Sheet Resistance of Aluminum Oxide Thin Films with Application to Integrated Moisture Sensors,” Int. Reliability Physics Symp., 249, San Diego, CA, Mar 30-Apr 1, 1992.
28. Striny, K. M., and Schelling, A. W., “Reliability Evaluation of Aluminum-Metallized MOS Dynamic RAMS in Plastic Packages in High Humidity and Temperature Environments,” Electronic Components and Technology Conf., 238, Atlanta, GA, May 11-13, 1981.
29. Comizzoli, R. B., Frankenthal, R. P., Milner, P. C., and Sinclair, J. D., “Corrosion of Electronic Materials and Devices,” Science, Vol. 234, 1986, p. 340.
30. Reich, B., “Study of Accelerated Storage Test Conditions Applicable to Semiconductor Devices and Microcircuits,” IEEE Trans. Reliability, Vol. R-27, 1978, p. 178.
31. Gunn, J. E., Camenga, R. E., and Malik, S. K., “Rapid Assessment of the Humidity Dependence of 1C Failure Modes by Use of HAST,” Int. Reliability Physics Symp., 66, Phoenix, AZ, Apr.5-7, 1983.
32. Stroehle, D., “Influence of the Chip Temperature on the Moisture-Induced Failure Rate of Plastic-Encapsulated Devices,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. CHMT-6, 1983, p. 537.
33. Peck, D. S., “Comprehensive Model for Humidity Testing Correlation,” Int. Reliability Physics Symp., 44, Anaheim, CA, Apr. 1-3, 1986.
34. Hoge, C. E., “Corrosion Criteria for Electronic Packaging: I. A Framework for Corrosion of Integrated Circuits,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. 13, 1990, p. 1090.
35. Tabata, T., Suzuki, H., Hamada, T., and Yamaguchi, M., “Internal Defects Observation of IC Package by Scanning Acoustic Tomography,” Nitto Tech. Reports, 70, 1987.
36. Yoshioka, O., Okabe N., Nagayama, S., and Murakami, G., “Improvement of Moisture Resistance in Plastic Encapsulants MOS-IC by Surface Finishing Copper Leadframe,” Electronic Components and Technology Conf., 464, Houston, TX, May 22-24, 1989.
37. Pignataro, S., Torrisi, A., and Ferla, G., “Interfacial Chemistry at Real Resin-Metal Interfaces of Electronic Devices,” Surface and Interface Analysis, 7, 129, 1985.
38. Kitagawa, H., Kidon, Y., Maeda, K., Umeda, Y., Sano, H., and Hase-gawa, S., “The Study of Plastic Package Cracking Induced by the Moisture/ Solder Reflow Process,” Electronic Components and Technology Conf., 445, Houston, TX, May 22-24, 1989.
39. Nguyen, L. f., and Michael, M., “Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages,” Electronic Components and Technology Conf., 930, San Diego, CA, May 18-20, 1992.
40. Yamaguchi, M., Nakamura, Y., Okubo, M., and Matsumoto, T., “Strength and Fracture Toughness of Epoxy Resin Filled with Silica Particles,” Nitto Tech. Reports, 74, 1991.
41. Nishimura, A., Tatemichi, A., Miura, H., and Sakamoto, T., “Life Estimation for IC Plastic Packages under Temperature Cycling Based on Fracture Mechanics,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, 637, Vol. CHMT-12, 1987.
42. Gee, S. A., Nguyen, L. T., and Akylas, V. R., “Wire Bonder Characterization Using a ‘PN Junction-Bond Pad’ Test Structure,” MEPPE FOCUS ‘91, 156, January 15-17, Santa Clara, CA, 1991.
43. Philofsky, E., “Intermetallic Formation in Gold Aluminum Systems,” Solid State Electronics, Vol. 13, 1970, p. 1391.
44. Thomas, R. W., Winchell, V., James, K., and Scharr, T., “Plastic Outgassing Induced Wire Bond Failure,” Electronic Components Conf, 182, Arlington, VA, May 16-18, 1977.
45. Gerling, W., “Electrical and Physical Characterization on Gold Ball Bonds on Aluminum Layers,” Electronic Components Conf., 13, New Orleans, LA, May 14-16, 1984.
46. Gale, R. J., “Epoxy Degradation Induced Au-Al Intermetallic Void Formation in Plastic Encapsulated MOS Memories,” Int. Reliability Physics Symp., 37, Las Vegas, NV, Apr. 3-5, 1984.
47. Blish, R. C., II, and Parobek, L., “Wire Bond Integrity Test Chip,” Int. Reliability Physics Symp., 142, Phoenix, AZ, Apr. 5-7, 1983.
48. Ritz, K. N., Stacy, W. T., and Broadbent, E. K., “The Microstructure of Ball Bonds Corrosion Failures,” Int. Reliability Physics Symp., 28, San Diego, CA, Apr. 7-9, 1987.
49. Sullivan, E., “Thermal Degradation of Epoxy Novolac-Phenol Formaldehyde Novolac Resin Systems,” J. Appl. Polym. Sei., Vol. 42, 1991, p. 1815.
50. Plunkett, P. V., and Dalporto, J. F., “Low Temperature Void Formation in Gold Aluminum Contacts,” Electronic Components Conf., 421, San Diego, CA, May 10-12, 1982.
51. Nakamura, Y., Uenlshi, S., Kunishi, T., Yamanaka, K., and Suzuki, H., “Development of Ultra-Low Stress Resin Encapsulants for Large-Chip Semiconductor Devices,” Nitto Tech. Reports, Vol. 23, 1991.
52. Nakao, M., Nishioka, T., Shimizu, M., Tabata, H., and Ito, K., “Degradation of Brominated Epoxy Resin and Effects on Integrated Circuit Device Wire Bonds,” Chapter 35, 4CS Symp. 407, Vol. 421, 1989.