Influence of the Chip Temperature on the Moisture-Induced Failure Rate of Plastic-Encapsulated Devices

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 6, Issue 4, 1983, Pages 537-543

  Stroehle, Dieter ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING - FAILURE; TELECOMMUNICATION EQUIPMENT;

MOISTURE-INDUCED FAILURE RATE; PLASTIC ENCAPSULATED DEVICES;

INTEGRATED CIRCUITS;

EID: 0020940531     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1983.1136209     Document Type: Article

References (8)

1. D. Stroehle, “Moisture Problems of LSIs,” in NTG Fachberichte Band 77, Großintegration 1981, 1981, pp. 106–109.
2. —, “Plastic encapsulated semiconductor components for telecommunication systems,” in Electrical Communication (ITT), volume 57, No. 2, pp. 152–157, 1982.
3. T. Ajiki, M. Sugimoto, H. Higuchi, and S. Kumada, “A new cyclic biased T. H. B. test for power dissipating ICs,” in 17th Annu. Proc. Rel. Phys. Symp., 1979, pp. 118–126.
4. D. W. Dycus, “Moisture uptake and release by plastic molding compounds—Its relationship to systems life and failure mode,” in 18th Annu. Proc. Rel. Phys. Symp., 1980, pp. 293–311.
5. N. Kuederle, “Temperatur-Feuchte-Test an kunststoffverkapselten integrierten Halbleiterschaltkreisen,” Elektronik Produktion und Prüftechnik, vol. 1/2, pp. 61–64, 1982.
6. S. P. Sim and R. W. Lawson, “The influence of plastic encapsulants and passivation layers on the corrosion of thin aluminium films subjected to humidity stress,” in 17th Annu. Proc. Rel. Phys. Symp., 1979, pp. 103–112.
7. N. L. Sbar and R. P. Kozakiewicz, “New acceleration factors for temperature, humidity, bias testing,” in 16th Annu. Proc. Rel. Phys. Symp., 1978, pp. 161–178.
8. N. Vanderkooi and M. N. Riddell, “Dynamic permeability method for epoxy encapsulation resius,” in 11th Annu. Proc. Phys. Symp., 1973, pp. 219–225.