A case study of plastic part delamination: An ITT experiment using accoustic microscopy narrowed the source of a die surface delamination reliability problem

Semiconductor International

Volumn 19, Issue 4, 1996, Pages 109-112

  Oren, Kerry ^a  

^a ITT Aerospace/Communications   (United States)

Author keywords

Acoustic microscopy; Molding compound delamination; Plastic packaging

Indexed keywords

EID: 0343510557     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. K. Van Doorselaer, T.M. Moore, J. van der Pol, "Failure Criteria for Inspection Using Acoustic Microscopy After Moisture Sensitivity Testing of Plastic Surface Mount Devices," Proceedings of the 20th Symposium for Testing and Failure Analysis (ISTFA 94), p. 232.
2. Sonoscan Inc., C-SAM Series Applications Manual, Case #8, October 1991.
3. T.M. Moore, R. McKenna, S. Kelsall, "The Application of Scanning Acoustic Microscopy to Control Moisture/Thermal-Induced Package Defects," Proceedings of the 16th International Symposium for Testing and Failure Analysis (ISTFA 90), p. 252.
4. R. Angeles, G. Ilog, J. Nicolas, T.M. Moore, K.S. Wills, "C-SAM Analysis of Plastic Packages to Resolve Bonding Failure Mode Miscorrelations," Proceedings of the 18th International Symposium for Testing and Failure Analysis (ISTFA 92), pp. 316-319.