A new procedure for measuring the decohesion energy for thin ductile films on substrates

Journal of Materials Research

Volumn 9, Issue 7, 1994, Pages 1734-1741

  Bagchi, A ^a   Lucas, G E ^a   Suo, Z ^a   Evans, A G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRACK PROPAGATION; FRACTURE MECHANICS; INTERFACES (MATERIALS); SUBSTRATES;

DECOHESION ENERGY; INTRINSIC STRESS; SUPERLAYERS;

THIN FILMS;

EID: 0028468445     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/JMR.1994.1734     Document Type: Article

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