Diffusion behavior and reliability in bonds between Au-Ag alloy and aluminum

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 63, Issue 12, 1999, Pages 1545-1554

  Uno, Tomohiro ^a   Tatsumi, Kohei ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANNEALING; DIFFUSION; GOLD ALLOYS; INTERFACES (MATERIALS); RELIABILITY; THIN FILMS; WIRE;

BOND RELIABILITY; THERMAL RELIABILITY; WIRE BONDING;

BONDING;

EID: 0033327407     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet1952.63.12_1545     Document Type: Article

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