Temperature and strain rate effect on mechanical properties of 63Sn/37Pb solder alloy

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Shi, X Q ^b   Pang, H L J ^a   Zhou, W ^a   Wang, Z P ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; ELASTOPLASTICITY; SOLDERING ALLOYS; STATISTICAL METHODS; STRAIN RATE; SURFACE MOUNT TECHNOLOGY; TENSILE STRENGTH; TENSILE TESTING; THERMAL EFFECTS; TIN ALLOYS; VISCOELASTICITY; VISCOPLASTICITY;

TIN-LEAD ALLOYS; VISCOELASTOPLASTICITY;

ELECTRONICS PACKAGING;

EID: 0033326043     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. JEDEC (Joint Electronic Device Engineering Council) Standard, 1989, "Temperature Cycling," JESD22-A104-A, Electronic Industries Association, USA.
2. JEDEC (Joint Electronic Device Engineering Council) Standard, 1995, "Thermal Shock," JESD22-A106-A, Electronic Industries Association, USA.
3. Jones, W. K., Liu, Y. Q., Zampino, M. A., and Gonzalez, G. L., 1997, "The At-Temperature Mechanical Properties of Lead-Tin Based Alloys," Advancing Microelectronics, pp30-34.
4. Kilinski, T. J., Lesniak, J. R., and Sandor B. I., 1991, "Modern Approaches to Fatigue Life Prediction of SMT Solder Joints," Solder Joint Reliability: Theory and Applications, ed. J. Lau , pp384-390.
5. Lau, J., and Pao, Y. H., 1997, "Solder Joint Reliability of BGA, Flip Chip, CSP, and Fine Pitch SMT Assemblies," New York: Van Nostrand Reinhold, Chapter 4.
6. Liu, S., and Qing, Z. F., 1997, "A Unified Viscoplastic Constitutive Model for Tin-Lead Solder Joints," Advances in Electronic Packaging, ASME EEP-Vol. 19-2, pp. 1599-1604.
7. Ninomiya, R., and Miyake, K., 1997, "Microstructure and Mechanical Properties of New Lead-Free Solder," Advances in Electronic Packaging, pp.1329-1333.
8. Sandor, B. I., Ju, S. H., and Plesha, M. E., 1996, "Life Prediction of Solder Joints by Damage and Fracture Mechanics," ASME Journal of Electronic Packaging, Vol.118 pp193-200.
9. Skipor, A. F., S.V. Harren, and J. Botsis, 1996, "On the constitutive Response of 63/37 Sn/Pb Eutectic Solder," ASME Journal of Engineering Materials and Technology, Vol. 118, pp. 1-11.
10. Vaynman, S., and Fine, M. E., 1989, "Fatigue of Low-Tin Lead-Based and Tin-Lead Eutectic Solders," Microelectronic Packaging Technology, ed. W. T. Shieh, pp255-259.