Mixed mode fracture of organic chip attachment adhesives

American Society of Mechanical Engineers, EEP

Volumn 11, Issue , 1995, Pages 179-185

  Brandenburger, Peter D ^a   Pearson, Raymond A ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EPOXY RESINS; FRACTURE MECHANICS; FRACTURE TESTING; FRACTURE TOUGHNESS; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; LOADS (FORCES); MICROELECTRONICS;

INTERFACIAL FRACTURE ENERGY; LOAD DISPLACEMENT RESPONSE; MIXED MODE BENDING (MMB) TEST; ORGANIC CHIP ATTACHMENT ADHESIVES;

PLASTIC ADHESIVES;

EID: 0029425063     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)