EM analysis of low inductance decoupling capacitors

IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993

Volumn , Issue , 1993, Pages 82-84

  Beker, B ^a   Cokkinides, G ^a   Templeton, A ^b  

^a UNIVERSITY OF SOUTH CAROLINA   (United States)

^b AVX CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED ANALYSIS; ELECTRONICS PACKAGING; INDUCTANCE;

COMPUTER AIDED DESIGN TOOLS; COMPUTER ANALYSIS; DECOUPLING CAPACITOR; ELECTROMAGNETIC MODELS; LOW INDUCTANCE; NUMERICAL RESULTS;

COMPUTER AIDED DESIGN;

EID: 85064754030     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.1993.394585     Document Type: Conference Paper

References (6)

1. N. Humenick, J M., Obcrschimdt. L. L. Wu, and S. C Paull. "Low inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors", IBM J Res Dev. vol 36. no 5, pp 935-942, September, 1992.
2. A E Ruehli and H Heeb, "Circuit models for three-dimensional geometries including dielectrics." IEEE Trans Microwave Theory Tech., vol. MTT-40. no 7. pp 1507-1516. July 1992
3. Metal™ and Henry™, 3-D Interconnection and Inductance simulators, by OEA International, Inc. Santa Clara. CA.
4. R Pjonsey and R. E. Collin, Principles and Applications of Electromagnetic Fields. Ch 3. New York: McGraw-Hill. 1961
5. B Beker and G. Coltkinidcs. "Inductance calculation of surface mount capacitors." Final Report USC-4HI430, University of South Carolina. Columbia. SC 29208. April 1993.
6. A. E Ruchii. "Inductance calculation in a complex integrated circuit environment." IBM J Res. Dev., vol 16. pp. 470-481. Sept 1972.