Thermomechanical stress analyses of plated-through holes in PWB using internal state variable constitutive models

American Society of Mechanical Engineers, EEP

Volumn 17, Issue , 1996, Pages 65-72

  Fu, Chiayu ^a   Ume, I Charles ^a   McDowell, David L ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER PLATING; CRACKS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; GLASS TRANSITION; RESIDUAL STRESSES; STRAIN; TEMPERATURE; TENSILE PROPERTIES; THERMAL STRESS;

PLATED THROUGH HOLES; PRINTED WIRING BOARDS; THERMOMECHANICAL STRESS ANALYSES;

PRINTED CIRCUIT BOARDS;

EID: 0030379448     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)