Thermal conductivity study of porous low K dielectric materials

Materials Research Society Symposium - Proceedings

Volumn 565, Issue , 1999, Pages 87-92

  Hu, Chuan ^a   Morgen, Michael ^a   Ho, Paul S ^a   Jain, Anurag ^b   Gill, William N ^b   Plawsky, Joel L ^b   Wayner Jr , Peter C ^b  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; PERMITTIVITY; POROSITY; POROUS MATERIALS; THERMAL CONDUCTIVITY; THIN FILMS;

INTERCONNECT STRUCTURE; THERMAL RESISTOR MODELS;

DIELECTRIC FILMS;

EID: 0033297511     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-565-87     Document Type: Article

References (7)

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6. K. E. Goodson, M. I. Flik, L. T. Su, and D. A. Antoniadis, IEEE Electron Devices Lett. 14, 490 (1993)
7. C. Hu et al, will be submitted to Appl. Phys. Lett.