Electromigration in thin film conductors

Defect and Diffusion Forum

Volumn 143-147, Issue , 1997, Pages 1661-1672

  Lloyd, J R ^a  

^a Lloyd Technology Associates Inc   (United States)

Author keywords

Electromigration; Grain boundary; Microstructure; Stress; Thin film

Indexed keywords

ELECTROMIGRATION; GRAIN BOUNDARIES; MICROSTRUCTURE; STRESSES;

MECHANICAL STRESS; THIN FILM CONDUCTORS;

THIN FILMS;

EID: 4243367238     PISSN: 10120386     EISSN: 16629507     Source Type: Journal    
DOI: 10.4028/www.scientific.net/DDF.143-147.1661     Document Type: Article

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