Reliability of a flip-chip package thermally loaded between -55 °C and 125 °C

Journal of Electronic Materials

Volumn 28, Issue 11, 1999, Pages 1150-1157

  Drexler, Elizabeth S ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRON BEAMS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MASKS; SOLDERING; SOLDERING ALLOYS; THERMAL CYCLING;

PLASTIC BALL GRID ARRAY (PBGA) PACKAGES;

FLIP CHIP DEVICES;

EID: 0033221784     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0150-7     Document Type: Article

References (16)

1. MIL-STD-883, Department of Defense Test Method Standard: Microcircuits (1996).
2. B. Han and Y. Guo, J. Electron. Pkg. 117, 185 (1995).
3. S.C. Machuga, S.E. Lindsey, K.D. Moore, and A.F. Skipor, Proc. IEEE/CHMT Int. Electron. Mfg. Technol. Symp. (New York: IEEE, 1992), p. 53.
4. J. . Nysæther, P. Lundstrm, and J. Liu, Proc. 1st IEEE Int. Symp. Polymeric Electron. Pkg. (New York: IEEE, 1998), p. 307.
5. J. Auersperg, D. Vogel, J. Simon, A. Schubert, and B. Michel, Design and Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 439.
6. S. Rzepka, M.A. Korhonen, E. Meusel, and C.-Y. Li, J. Electron. Pkg. 120, 342 (1998).
7. M. Kawai, M. Harada, A. Andou, O. Yamada, R. Satoh, and T. Netsu, Proc. 46th Electron. Components and Technol. Conf. (New York: IEEE, 1996), p. 1196.
8. X. Dai and P.S. Ho, Proc. IEEE/CPMT 21st Int. Electron. Mfg. Technol. Symp. (New York: IEEE, 1998), p. 326 .
9. B. Han, K. Verma, M. Chopra, S. Park, and L. Li, Advanced Electron. Mfg. Technologies (Edina, MN: Surface Mount Int. 1997), p. 43.
10. B. Michel and D. Vogel, Experimental Mechanics, ed. Allison, (Rotterdam, The Netherlands: Balkema, 1998), p. 965.
11. D.T. Read and J.W. Dally, J. Res. Natl. Inst. Stand. Technol. 101, 47 (1996).
12. E.S. Drexler, Procedures for the Electron-Beam Moiré Technique, NIST Technical Note 1500-2 (Washington, D.C.: U.S. Government Printing Office, 1998), pp. 133.
13. Metals Handbook 9th Edition, Vol. 2. Properties and Selection: Nonferrous Alloys and Pure Metals (Metals Park, OH: American Society for Metals, 1979).
14. Electronic Materials Handbook, Vol. 1. Packaging (Metals Park, OH: ASM Int., 1989).
15. R. Munroe, personal communication.
16. A. Schubert, R. Dudek, B. Michel, H. Reichl, and H. Jiang, Proc. 3rd Int. Symp. Adv. Pkg. Mater. Processes, Properties and Interfaces (Reston, VA: IMAPS, 1997), p. 106.