Highly accurate design of thermal fatigue life for flipchip joint

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1196-1201

  Kawai, Michifumi ^a   Harada, Masahide ^a   Andou, Akihiro ^a   Yamada, Osamu ^a   Satoh, Ryouhei ^a   Netsu, Toshitada ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FATIGUE TESTING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MELTING; STRAIN; TEMPERATURE DISTRIBUTION; THERMAL CYCLING; THERMOANALYSIS;

FLIP CHIP JOINT; HIGH DENSITY FLIP CHIP PACKAGE; STRAIN RANGE; THERMAL CYCLIC TESTS; THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 0029708086     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)