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Volumn 39, Issue 6-7, 1999, Pages 1143-1148

Damage analysis in smart-power technology electrostatic discharge (ESD) protection devices

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; DEFECTS; ELECTRIC DISCHARGES; ELECTRIC SPACE CHARGE; INFRARED SPECTROSCOPY; LEAKAGE CURRENTS; NUMERICAL ANALYSIS; POWER ELECTRONICS; SEMICONDUCTOR DIODES;

EID: 0033143207     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00162-6     Document Type: Article
Times cited : (12)

References (11)
  • 2
    • 0028737473 scopus 로고
    • Device integration for ESD robustness of high voltage power MOSFETs
    • Duvvury C, Rodriguez J, Jones C and Smayling M. Device integration for ESD robustness of high voltage power MOSFETs. Proc. IEDM'94 (1994) pp.407-410.
    • (1994) Proc. IEDM'94 , pp. 407-410
    • Duvvury, C.1    Rodriguez, J.2    Jones, C.3    Smayling, M.4
  • 5
    • 0029276101 scopus 로고
    • IC failure analysis: Techniques and tools for quality and reliability improvement
    • Soden JM and Anderson RE. IC failure analysis: Techniques and tools for quality and reliability improvement. Microel. Reliab. 33 (1995) pp.429-453.
    • (1995) Microel. Reliab. , vol.33 , pp. 429-453
    • Soden, J.M.1    Anderson, R.E.2
  • 6
    • 0032204212 scopus 로고    scopus 로고
    • ESD failure methodology
    • Colvin J, ESD failure methodology, Microel. Reliab. 38 (1998) 1705-1714.
    • (1998) Microel. Reliab. , vol.38 , pp. 1705-1714
    • Colvin, J.1
  • 7
    • 0027794535 scopus 로고
    • Suppresion of soft failures in a submicron CMOS process
    • Kuper F, Luchies JM and Bruines J. Suppresion of soft failures in a submicron CMOS process. EOS/ESD Symposium (1993) pp.117-122.
    • (1993) EOS/ESD Symposium , pp. 117-122
    • Kuper, F.1    Luchies, J.M.2    Bruines, J.3
  • 8
    • 0032204213 scopus 로고    scopus 로고
    • An attempt to explain thermally induced soft failures during low level ESD stresse: Study of the differences between soft and hard NMOS failures
    • Salome P, Leroux C, Mariolle D, Lafond D, Chante JP, Crevel P and Reimbold G. An attempt to explain thermally induced soft failures during low level ESD stresse: study of the differences between soft and hard NMOS failures. Microel. Rel. (1998) 17631772.
    • (1998) Microel. Rel. , pp. 1763-1772
    • Salome, P.1    Leroux, C.2    Mariolle, D.3    Lafond, D.4    Chante, J.P.5    Crevel, P.6    Reimbold, G.7
  • 11
    • 0004005306 scopus 로고
    • John Wiley & Sons
    • nd edn) John Wiley & Sons (1981).
    • (1981) nd Edn)
    • Sze, S.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.