Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy

Microelectronics Reliability

Volumn 39, Issue 6-7, 1999, Pages 1095-1101

  Bechou, L ^a   Angrisiani, L ^b   Ousten, Y ^a   Dallet, D ^a   Levi, H ^a   Daponte, P ^c   Danto, Y ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

^b UNIVERSITY OF SALERNO   (Italy)

^c UNIVERSITY OF SANNIO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; ALGORITHMS; ASSEMBLY; DEFECTS; FAILURE ANALYSIS; IMAGE PROCESSING; MICROSCOPIC EXAMINATION; ULTRASONICS; WAVELET TRANSFORMS;

ACOUSTIC IMAGE INTERPRETATION; CONTINUOUS WAVELET TRANSFORMS; DEFECT LOCALIZATION; DIE ATTACH ASSEMBLY; SCANNING ACOUSTIC MICROSCOPY; TIME OF FLIGHT;

ELECTRONICS PACKAGING;

EID: 0033143206     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00155-9     Document Type: Article

References (9)

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