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Volumn 1996-November, Issue , 1996, Pages 277-283

Failure Analysis of Flip-Chip Interconnections through Acoustic Microscopy

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FAILURE (MECHANICAL); FAILURE ANALYSIS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT INTERCONNECTS; SCANNING; SOLDERING; ULTRASONIC TESTING;

EID: 0041618906     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1996p0277     Document Type: Conference Paper
Times cited : (5)

References (5)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.