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Volumn 1996-November, Issue , 1996, Pages 277-283
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Failure Analysis of Flip-Chip Interconnections through Acoustic Microscopy
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Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
FAILURE (MECHANICAL);
FAILURE ANALYSIS;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT INTERCONNECTS;
SCANNING;
SOLDERING;
ULTRASONIC TESTING;
ACOUSTIC MICROSCOPY;
BALL JOINTS;
BONDWIRE;
FLIP CHIP;
FLIP CHIP TECHNOLOGIES;
FLIP-CHIP INTERCONNECTION;
INTEGRATION APPLICATION;
NON DESTRUCTIVE;
PIN COUNTS;
ULTRALARGE SCALE INTEGRATION;
ACOUSTIC MICROSCOPES;
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EID: 0041618906
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.31399/asm.cp.istfa1996p0277 Document Type: Conference Paper |
Times cited : (5)
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References (5)
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