Repeatability aspects in surface micromachining - investigations on polycrystalline silicon films

Journal of Micromechanics and Microengineering

Volumn 9, Issue 2, 1999, Pages 130-134

  Elbrecht, L ^a,b   Binder, J ^a  

^a UNIVERSITY OF BREMEN   (Germany)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; MICROMACHINING; MICROSENSORS; POLYCRYSTALLINE MATERIALS; SILICON WAFERS; STRESSES; SURFACE TREATMENT; THICKNESS MEASUREMENT;

MECHANICAL STRESS; POLYCRYSTALLINE SILICON FILMS; SURFACE MICROMACHINING;

THIN FILMS;

EID: 0033138338     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/9/2/007     Document Type: Article

References (5)

1. Core T A, Tsang W K and Sherman S J 1993 Fabrication technology for an integrated surface micromachined sensor Solid State Technol. Oct. 39-47
2. Guckel H, Burns D W, Tilmans H A C, DeRoo D W and Rutigliano C R 1988 Mechanical properties of fine grained polysilicon - the repeatability issue Tech. Dig. IEEE Solid State Sensor and Actuator Workshop (Hilton Head Island, 1988) pp 96-9
3. 3 diffusion doping Sensors Actuators A 61 374-8
4. Elbrecht L, Storm U, Catanescu R and Binder J 1997 Comparison of stress measurement techniques in surface micromachining J. Micromech. Microeng. 7 151-4
5. Maier-Schneider D, Köprülülü A, Ballhausen-Holm S and Obermeier E 1996 Elastic properties and microstructure of LPCVD polysilicon films J. Micromech. Microeng. 6 436-46