Tip-on-tip: A novel AFM tip configuration for the electrical characterization of semiconductor devices

Microelectronic Engineering

Volumn 46, Issue 1, 1999, Pages 113-116

  Hantschel, T ^a   Trenkler, T ^a   Vandervorst, W ^a,c   Malave A ^b   Buchel D ^b   Kulisch, W ^b   Oesterschulze, E ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF KASSEL   (Germany)

^c Katholieke Universitieit   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE TESTING;

TIP-ON-TIP CONCEPT;

ATOMIC FORCE MICROSCOPY;

EID: 0033130761     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00028-3     Document Type: Article

References (7)

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2. 2. P. De Wolf, T. Clarysse, W. Vandervorst, L. Hellermans, P. Niedermann, W. Hänni, J. Vac. Sci. Technol., B 16, 355 (1998).
3. 3. W. Kulisch, A. Malavé, G. Lippold, W. Scholz, C. Mihalcea, E. Oesterschulze, Diamond and Related Materials, 6, 906 (1997).
4. 4. T. Hantschel, P. De Wolf, T. Trenkler, R. Stephenson, W. Vandervorst, Proc. Micromach, and Microfabr. 98, to be published.
5. 5. A. Malavé, E. Oesterschulze, W. Kulisch, T. Trenkler, T. Hantschel, W. Vandervorst, Proc. Diamond 98, to be published.
6. 6. T. Hantschel, W. Vandervorst, Microelectronic Microengineering, 35, 405 (1997).
7. 7. E. Oesterschulze, W. Scholz, C. Mihalcea, D. Albert, B. Sobisch, W. Kulisch, Appl. Phys. Lett., 70, 435 (1997).