A micromachined flow shear-stress sensor based on thermal transfer principles

Journal of Microelectromechanical Systems

Volumn 8, Issue 1, 1999, Pages 90-98

  Liu, Chang ^a,b   Huang, Jin Biao ^d,e,f   Zhu, Zhenjun ^b   Jiang, Fukang ^c,g   Tung, Steve ^d   Tai, Yu Chong ^c   Ho, Chih Ming ^d  

^a IEEE   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^c California Institute of Technology   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e Department of Theoretical and Applied Mechanics and the Cornell Nanofabrication Facility   (United States)

^f NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

^g CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIAPHRAGMS; HEAT TRANSFER; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; POLYCRYSTALLINE MATERIALS; SHEAR STRESS; SILICON NITRIDE; SUBSTRATES; WIND TUNNELS;

MICROHOT FILM SHEAR-STRESS SENSORS;

MICROSENSORS;

EID: 0033099130     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.749408     Document Type: Article

References (31)

1. J. H. Haritonidis, "The measurement of wall shear stress," Advances in Fluid Mechanics Measurements. New York: Springer-Verlag, pp. 229-261, 1989.
2. R. J. Goldstein, Fluid Mechanics Measurements. New York: Hemisphere, p. 61, 1983.
3. J. H. Preston, "The determination of turbulent skin friction by means of Pitot tubes," J. R. Aero. Soc., vol. 58, pp. 109-121, 1953.
4. J. H. Hool, "Measurement of skin friction using surface tubes," Aircr. Eng., vol. 28, p. 52, 1956.
5. L. F. East, "Measurement of skin friction at low subsonic speeds by the razor-blade technique," R & M 3525, Aero. Res. Counc., London, U.K., 1966.
6. M. A. Schmidt, R. T. Howe, S. D. Senturia, and J. H. Haritonidis, "Design and calibration of a microfabricated floating-element shearstress sensor," IEEE Trans. Electron. Devices, vol. 35, no. 6, pp. 750-757, 1988.
7. J. Shajii, K. Y. Ng, and M. A. Schmidt, "A microfabricated floating-element shear-stress sensor using wafer-bonding technology," IEEE J. Microelectromech. Syst., vol. 1, no. 2, pp. 89-94, 1992.
8. A. Padmanabhan, H. Goldberg, K. D. Breuer, and M. Schmidt, "A wafer bonded floating element shear stress microsensor with optical position sensing by photodiodes," IEEE J. Microelectromech. Syst.., vol. 5, no. 4, pp. 307-315, 1996.
9. T. J. Hanratty and J. A. Cambell, "Measurement of wall shear stress," Fluid Mechanics Measurements, R. J. Goldstein, Ed.. New York: Hemisphere, pp. 559-615, 1983.
10. E. Kälvesten, C. Vieider, L. Löfdahl, and G. Stemme, "An integrated pressure-flow sensor for correlation measurements in turbulent gas flows," Sens. Actuators, vol. A52, pp. 51-58, 1996.
11. B. W. van Oudheusden and J. H. Huijsing, "Integrated flow friction sensor," Sens. Actuators, vol. A15, pp. 135-144, 1988.
12. B. W. van Oudheusden, "Silicon thermal flow sensors," Sens. Actuators, vol. A30, pp. 5-26, 1992.
13. K. Petersen, J. Brown, and R. Legtenberg, "High-precision, high-performance mass flow sensor with integrated laminar flow microchannels," in Proc., 1985 Int. Conf. Solid-State Sensors and Actuators, pp. 361-363.
14. Y. C. Tai and R. S. Muller, "Lightly-doped polysilicon bridge as a flow meter," Sens. Actuators, vol. 15, pp. 63-75, 1988.
15. C. H. Mastrangelo, Master's thesis, Univ. Calif. Berkeley, CA, 1987.
16. O. Tabata, "Fast-response silicon flow sensor with an on-chip fluid temperature sensing element," IEEE Trans. Electron Devices, vol. 33, pp. 361-365, 1986.
17. B. W. van Oudheusden and A. W. van Herwaarden, "High sensitivity 2-D flow sensor with an etched thermal isolation structure," Sens. Actuators, vols. A21-23, pp. 425-430, 1990.
18. L. Lofdahl, G. Stemme, and B. Johansson, "A sensor based on silicon technology for turbulence measurements," J. Phys. E: Sci. Instrum., vol. 22, pp. 391-393, 1989.
19. G. N. Stemme, "A monolithic gas flow sensor with polyimide as thermal insulator," IEEE Trans. Electron Devices, vol. ED-33, p. 1470, 1986.
20. S. Wolf and R. N. Tauber, Silicon Processing for the VLSI Era, vol. 1. Sunset Beach, CA: Lattice, 1986.
21. S. M. Sze, VLSI Technology, 2nd ed. New York: McGraw-Hill, 1988.
22. E. Ibok and S. Garg, "A characterization of the effect of deposition temperature on polysilicon properties," J. Elec. Chem. Soc., vol. 140, no. 10, pp. 2927-2937, Oct. 1993.
23. C. Liu and Y. C. Tai, "Studies on the sealing of micromachined cavities using chemical vapor deposition materials," in Technical Digest, Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, 1994, pp. 103-106.
24. K. C. Saraswat and H. Singh, "Thermal oxidation of heavily phosphorous-doped thin films of polycrystalline silicon," J. Electrochem. Soc., vol. 129, pp. 2321-2326, 1982.
25. S. Tung, personal communication.
26. J. B. Huang, C. Liu, F. K. Jiang, S. Tung, Y. C. Tai, and C. M. Ho, "Fluidic shear-stress measurement using surface-micromachined sensors," in IEEE 1995 Region 10 Conf. Microelectronics and VLSI, Hong Kong, Nov. 1995, pp. 570-574.
27. B. Gupta, R. Goodman, F. Jiang, and Y. C. Tai, "Analog VLSI system for active drag reduction," IEEE J. Microelectromech. Syst., vol. 16, no. 5, pp. 53-59, 1996.
28. M. J. Moen and S. P. Schneider, "The effect of sensor size and substrate properties on the performance of flush-mounted hot-film sensors," Thermal Anemometry - 1993, D. E. Stock, S. A. Sherif, A. J. Smits, and J. Davidson, Eds. ASME, pp. 249-261, 1993.
29. J. B. Huang, C. M. Ho, S. Tung, C. Liu, and Y. C. Tai, "Micro thermal shear stress sensor with and without cavity underneath," in IEEE Instrumentation/Measurement Tech. Conf., IMTC'95, Waltham, MA, Apr. 1995, pp. 171-174.
30. A. K. Hussain and W. C. Reynolds, "The mechanics of a perturbation wave in turbulent shear flow," AFOSR Scientific Rep. 177SR-1655TR.
31. J. Q. Liu, "Integrated micro devices for small scale gaseous flow study," Ph.D. dissertation, Calif. Instil. Technol., Pasadena, 1995.