Microscale lithography via channel stamping: Relationships between capillarity, channel filling, and debonding

Applied Physics Letters

Volumn 74, Issue 9, 1999, Pages 1332-1334

  Moran, P M ^a,b   Lange, F F ^a  

^a University of California   (United States)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; CRACK PROPAGATION; EVAPORATION; HEAT TREATMENT; INK; INTEGRATED CIRCUIT MANUFACTURE; POLYMERS; SHRINKAGE; SOLUTIONS; SUBSTRATES; WETTING;

CHANNEL FILLING; CHANNEL STAMPING; DEBONDING; METALLO ORGANIC PRECURSOR SOLUTION; MICROSCALE LITHOGRAPHY;

LITHOGRAPHY;

EID: 0033095222     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.123541     Document Type: Article

References (9)

1. W. M. Moreau, Semiconductor Lithography: Principles and Materials (Plenum, New York, 1988).
2. A. Kumar, H. A. Biebuyck, and G. M. Whitesides, Langmuir 10, 1498 (1994).
3. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, J. Vac. Sci. Technol. B 14, 4129 (1996).
4. J. R. Rice, J. Appl. Mech. 35, 379 (1968).
5. Abaqus User's Manual, Version 5.5 (Hibbert, Karlsson and Sorrensen, Inc., Providence, RI).
6. AZP4210 photoresist, KTI Chemicals Inc diluted with 10-15 parts isopropanol before spinning.
7. R. W. Vest, in Ceramic Films and Coatings, edited by J. B. Wachtman and R. A. Haber (Noyes, Park Ridge, NJ, 1993), p. 303.
8. ZrO(C7H15COO)2 in mineral spirits (∼6% Zr), as received from Strem Chemicals, Inc.
9. F. F. Lange, Science 273, 903 (1996).