Mechanism of direct copper plating on nonconducting substrates

Journal of the Electrochemical Society

Volumn 146, Issue 1, 1999, Pages 160-166

  Ono, Sachiko ^a,b  

^a WASEDA UNIVERSITY   (Japan)

^b SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CATALYSIS; CATALYSTS; COLLOIDS; HIGH RESOLUTION ELECTRON MICROSCOPY; PALLADIUM; PARTICLE SIZE ANALYSIS; RESINS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TIN; TRANSMISSION ELECTRON MICROSCOPY;

DIRECT COPPER PLATING;

COPPER PLATING;

EID: 0032758209     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391580     Document Type: Article

References (4)

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3. S. M. Yang, Printed Circuit Board Inform., 80, 64 (1994).
4. C. H. Yang, Y. Y. Wang, C. C. Wan, and C. J. Chen, J. Electrochem. Soc., 143, 3521 (1996).