Next generation nb superconductor integrated circuit process

IEEE Transactions on Applied Superconductivity

Volumn 9, Issue 2 PART 3, 1999, Pages 3228-3231

  Abelson, Lynn A ^a   Elmadjian, Raffi N ^a   Kerber, George L ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; JOSEPHSON JUNCTION DEVICES; NIOBIUM; PHOTOLITHOGRAPHY; REACTIVE ION ETCHING; SPUTTERING; SULFUR COMPOUNDS;

CRITICAL DIMENSION; NIOBIUM SUPERCONDUCTOR INTEGRATED CIRCUIT;

SUPERCONDUCTING MATERIALS;

EID: 0032683864     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.783716     Document Type: Article

References (6)

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2. J.E. Sauvageau el al., "Superconducting Integrated Circuit Fabrication with Low Temperature ECR-based PECVD SiO2 Dielectric Films," IEEE Trans. Appl. Supercond., vol. 5, pp. 2303-2309, June 1995.
3. W.H. Chang, "The Inductance of a Superconducting Strip Transmission Line," J. Appl. Phys., vol. 50, pp. 8129-8134, December 1979.
4. M. Johnson, TRW, Redondo Beach, Calif., personal communication, 1998.
5. K. K. Likharev and V. K. Semenov, "RSFQ Logic/Memory Family: A New Josephson-Junction Technology for Sub-Terahertz-Clock-Frequency Digital Systems," IEEE Trans. Appl. Supercond., vol. 1, pp. 3-28, March 1991.
6. Q. Herr, TRW, Redondo Beach, Calif., personal communication, 1998.