Superconducting Integrated Circuit Fabrication With Low Temperature ECR-Based PECVD SiO2 Dielectric Films

IEEE Transactions on Applied Superconductivity

Volumn 5, Issue 2, 1995, Pages 2303-2309

  Sauvageau, J E ^a   Burroughs, C J ^a   Booi, P A A ^a   Cromar, M W ^a   Benz, S P ^a   Koch, J A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DIELECTRIC FILMS; ELECTRON CYCLOTRON RESONANCE; JOSEPHSON JUNCTION DEVICES; LOW TEMPERATURE OPERATIONS; OSCILLATORS (ELECTRONIC); SILICA; SQUIDS; STATISTICAL PROCESS CONTROL; SUPERCONDUCTING DEVICES; VLSI CIRCUITS; VOLTAGE MEASUREMENT;

ENDPOINT DETECTION; JOSEPHSON VOLTAGE STANDARDS; SCALE ARRAY OSCILLATORS; SUPERCONDUCTING INTEGRATED CIRCUIT;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029325868     PISSN: 10518223     EISSN: 15582515     Source Type: Journal    
DOI: 10.1109/77.403046     Document Type: Article

References (22)

1. G. Box, W. Hunter and J. Hunter, Statistics for Experiments, John Wiley and Sons, New York, 1978.
2. M.S. Phadke, Quality Engineering Using Robust Design, Prentice Hall, Englewood Cliffs, New Jersey, 1989.
3. W. Mendenhall and T. Sincich, Statistics for Engineering and the Sciences, Dellen/MacMillan Publishing Co., San Francisco, California, 1992.
4. M.G. Buehler, S.D. Grant and W.R. Thurber, “Bridge and Van der Pauw sheet resistors for characterizing the line width of conducting layers,” J. Electrochem. Soc., vol. 125,pp. 650-654, 1978.
5. P.A.A. Booi, C.A. Livingston, and S.P. Benz, “Intrinsic stress in dc sputtered niobium,” IEEE Trans. Appl. Supercon., vol. 3, pp. 3029-3031, June 1993.
6. M. Huber, “Effect of etching parameters on leakage current and voltage noise of Josephson tunnel junctions,” Department of Physics, University of Colorado at Denver, Denver, Colorado, preprint.
7. M. Hidaka, H. Tsuge, and Y. Wada, “Thermal stability of Nb/AlOx/Nb Josephson junctions,” in Advances in Cryogenic Engineering Materials, A.F. Clark and R.P. Reed, Eds., vol. 34, pp. 765-772, Plenum Press, New York, 1987.
8. A.T. Barfnecht, R.C. Ruby, and H. Ko, “A simple and robust niobium Josephson junction integrated circuit process,” IEEE Trans. Mag., vol. 27, pp. 3125-3128, 1991.
9. L. Gronberg, H. Seppa, R. Cantor, M. Kiviranta, T. Ryhanen, J. Salmi, I. Suni, “A low noise dc SQUID based on Nb/Al-AlOx/Nb Josephson junctions,” in Superconducting Devices and Their Applications, H. Koch and H. Lubbig, Eds., p. 281, Springer-Verlag, Berlin, 1992.
10. M.B. Ketchen et al., “Sub-pm linewidth input coils for low Tc integrated thin-film dc superconducting quantum interference devices,” Appl. Phys. Lett., vol. 61, pp. 336-338, 1992.
11. A.T. Barfknecht, R.C. Ruby, H. Ko, and G.S. Lee, “Josephson junction integrated circuit process with planarized PECVD SiO2dielectric,” IEEE Trans. Appl. Supercon., vol. 3, pp. 2201-2204, 1993.
12. J. Asmussen, “Electron cyclotron resonance microwave discharges for etching and thin-film deposition,” J. Vac. Sci. Technol. A, vol. 7, p. 883, 1989.
13. A.I. Khun and J.A. Cornell, Response Surfaces, Designs and Analyses, vol. 81, p. 116, ASQC Quality Press, New York, 1987.
14. J.E. Sauvageau, C.J. Burroughs, M.W. Cromar and J.A. Koch, “Optimization of ECR-based PECVD oxide films for superconducting integrated circuit fabrication,” 37th Annual Technical Conference Proceedings of the Society of Vacuum Coaters, 1994.
15. T. Kaplan, Cryoelectronic Metrology Group, NIST Boulder, private communication.
16. M. Bhushan, Physics Department, SUNY Stony Brook, NY, private communication.
17. C. Steinbruchel, H.W. Lehmann and K. Frick, “Mechanism of dry etching of silicon dioxide,” J. Electrochem. Soc., vol. 132, pp. 180-186, 1985.
18. L.B. Valdes, “Resistivity measurements on germanium for transistors,” Proc. IRE, vol. 42, pp. 420-427, 1994.
19. M.S. Shivaraman and C.M. Svensson, “Control of palladium adherence to silicon dioxide for photolithographic etching,” J. Electrochem. Soc., vol. 123, p. 1258, 1976.
20. A. Smith, et al., “Reproducibility of Nb Josephson junction critical currents: statistical analysis and data,” IEEE Trans. on Supercon., vol. 3, no. 1 pp. 2174-2177, 1993.
21. D. Yen, “Electrical test methods for evaluating lithographic processes and equipment,” SPIE Integrated Circuit Metrology, vol. 342, p. 73, 1982.
22. J.E. Sauvageau, D.G. McDonald and E.N. Grossman, “Superconducting kinetic inductance radiometer,” IEEE Trans. Magn, vol. 27, pp. 2757-2760, 1991.