Micromachined switches for low electric loads

Sensors and Actuators, A: Physical

Volumn 74, Issue 1, 1999, Pages 203-206

  Hiltmann, K ^a   Keller, W ^a   Lang, W ^a  

^a Hahn Schickard Gesellschaft (HSG)   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; ELECTRIC RESISTANCE; ELECTRIC SWITCHES; SILICON WAFERS;

CONTACT RESISTANCE; MICROMACHINED SWITCH;

MICROSENSORS;

EID: 0032677313     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00317-3     Document Type: Article

References (5)

1. Schimkat J., Gevatter H.-J., Kiesewetter L. Gold-nickel als kontaktwerkstoff für ein silizium-mikrorelais. Feinwerktechnik und Meßtechnik. 104:1996;515-518.
2. J. Schimkat, Contact materials for microrelays, Proc. IEEE MEMS 98, Heidelberg, DE, 25.-29.01.98, IEEE Cat. Nr. 98CH36176, 190 194.
3. S. Majumder, N.E. McGruer, P.M. Zavracky, G.G. Adams, R.H. Morrison, J. Krim, Measurement and modeling of surface micromachined, electrostatically actuated microswitches, Tech. Digest IEEE Transducers 97, June 16-19, 1997, EEE. Cat-No. 97TH8267 1145 1148.
4. K.M. Hiltmann, B. Schmidt, H. Sandmaier, W. Lang, Development of micromachined switches with increased reliability, Tech. Digest IEEE Transducers 97, June 16-19, 1997, IEEE. Cat-No. 97TH8267 1157 1160.
5. K.M. Hiltmann, Gold metallizations: adhesion and barrier layers, HSG-IMIT internal report 1995-05-17.