Adhesion of copper films deposited onto aluminum nitride

Journal of Materials Science

Volumn 34, Issue 8, 1999, Pages 1933-1942

  Park, J W ^a   Pedraza, A J ^a   Lowndes, D H ^b  

^a University of Tennessee   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; AUGER ELECTRON SPECTROSCOPY; COPPER; INTERFACES (MATERIALS); LASER APPLICATIONS; METALLIC FILMS; SUBSTRATES;

ALUMINUM NITRIDE; COPPER FILMS;

ALUMINUM COMPOUNDS;

EID: 0032665950     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004544200291     Document Type: Article

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