Very small critical current spreads in Nb/Al-AlOx/Nb integrated circuits using low-temperature and low-stress ECR PECVD silicon oxide films

IEEE Transactions on Applied Superconductivity

Volumn 9, Issue 2 PART 3, 1999, Pages 3208-3211

  Meng, Xiaofan ^a   Bhat, Anupama ^a   Van Duzer, Theodore ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); ELECTRON CYCLOTRON RESONANCE; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; LOW TEMPERATURE OPERATIONS; NIOBIUM COMPOUNDS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICA;

NIOBIUM INTEGRATED CIRCUITS; SILICON OXIDE FILMS;

SUPERCONDUCTING MATERIALS;

EID: 0032659522     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.783711     Document Type: Article

References (10)

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