Cryogenic packaging for multi-GHz electronics

IEEE Transactions on Applied Superconductivity

Volumn 9, Issue 2 PART 3, 1999, Pages 3173-3176

  Tighc, T S ^a   Akerling, G ^a   Smith, A D ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BERYLLIUM; COAXIAL CABLES; COMPUTER SIMULATION; COMPUTER SOFTWARE; COPPER; CRYOGENICS; ELECTRIC PROPERTIES; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY; THERMODYNAMIC PROPERTIES;

CRYOGENIC PACKAGING; FLEXIBLE RIBBON CABLING; PRESS CONTACT SURFACE MOUNTS; SUPERCONDUCTING ELECTRONICS;

SUPERCONDUCTING DEVICES;

EID: 0032645881     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.783703     Document Type: Article

References (8)

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2. L.A. Abelson, R.N. Elmadjian, G.L. Kerber, and A.D. Smith Superconductive Multi-chip module for High Speed Digital Applications, IEEE Trans. Appl. Superconductivity, 7, 2627 (1997).
3. Precision Tube Co., Inc. of Salisbury, MD for example.
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5. Manufactured by Tech-Etch of Plymouth, MA.
6. Suhner part no. 82 SMA -50-0-1.
7. Sinda/G by Network Analysis, Tempe AZ.
8. M. Early, S. Lee, and M. Pellilo Thermal performance of interface material in microelectronics packaging applications, unpublished.