Superconductive multi-chip module process for high speed digital applications

IEEE Transactions on Applied Superconductivity

Volumn 7, Issue 2 PART 3, 1997, Pages 2627-2630

  Abelson, Lynn A ^a   Elmadjian, Raffi N ^a   Kerber, George L ^a   Smith, A D ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MASKS; MICROSTRIP LINES; MULTICHIP MODULES; POLYMERS; REACTIVE ION ETCHING; SPUTTER DEPOSITION; SUPERCONDUCTING DEVICES;

SUPERCONDUCTING MICROSTRIP LINES;

DIGITAL INTEGRATED CIRCUITS;

EID: 0031163257     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.621778     Document Type: Article

References (9)

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