Creep behaviour of a nanocrystalline Fe-B-Si alloy

Scripta Materialia

Volumn 36, Issue 3, 1997, Pages 299-303

  Xiao, Menglei ^a   Kong, Q P ^a  

^a INSTITUTE OF SOLID STATE PHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPACTION; CREEP; CRYSTALLIZATION; DIFFUSION; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; INTERFACES (MATERIALS); NANOSTRUCTURED MATERIALS; POROSITY; TEMPERATURE; TENSILE TESTING;

DISLOCATION MOTION; GRAIN BOUNDARY DIFFUSION; IRON BORON SILICON ALLOY; TENSILE CREEP TESTS;

IRON ALLOYS;

EID: 0031062071     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(96)00371-5     Document Type: Article

References (15)

1. G.W. Nieman, J.R. Weertman and R.W. Siegel, Scripta Metall. Mater., 24, 145 (1990).
2. H. Hahn and R.S. Averback, J.Am.Ceram.Soc., 74, 2918 (1991).
3. F. Nuxoll, J. Gossing, H. Brandt and H. Neuhauser, Proc. 10th Inter.Conf. on Strength of Materials, Ed. H. Oikawa et al., p.815, The Japan Institute of Metals, (1994).
4. D.L. Wang, Q.P. Kong and J.P, Shui, Scripta Metall. Mater., 31, 47 (1994).
5. J. Deng, D.L. Wang, Q.P. Kong and J.P, Shui, Scripta Metall. Mater., 32, 349 (1995).
6. Q.P. Kong, D.L. Wang, J. Deng and J.P. Shui, Progress in Natural Science, 6, 176 (1996).
7. H.Y. Tong, J.T. Wang, B.Z. Ding, H.G. Jiang and K. Lu, J. Non-Crystalline Solids, 150, 444, (1992).
8. F.R.N. Nabarro, Report on a Conference on Strength of Solids, p.75, Physical Society, London, (1948).
9. C.H. Herring, J.Appl.Phys., 21, 437 (1950).
10. R.L. Coble, J.Appl.Phys., 34, 1679 (1963).
11. N. Wang, Z. Wang, K.T. Aust and U. Erb, Acta Metall.Mater., 43, 519 (1995).
12. G. Palumbo, S.J. Thorpe and K.T. Aust, Scipta Metall.Mater., 24, 1347 (1990).
13. Smithells Metals Referance Book, Ed. E.A. Brandes, 6th Edition, p. 13-95, Butterworths, London (1983).
14. M.F. Ashby and R.A. Verrall, Acta Metall., 21, 149 (1973).
15. O.D. Sherby and J. Wadsworth, Prog.Mater. Sci., 33, 169 (1989).