Cordierite-based dielectric thick films on an oxidized copper layer: microstructural evidence of copper diffusion

Journal of the American Ceramic Society

Volumn 82, Issue 7, 1999, Pages 1949-1952

  Cho, Yong S ^a,b   Hoelzer, David T ^a,c   Schulze, Walter A ^a   Amarakoon, Vasantha R W ^a  

^a ALFRED UNIVERSITY   (United States)

^b DUPONT COMPANY   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER COMPOUNDS; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; DENSIFICATION; DEPOSITION; DIFFUSION; FIRING (OF MATERIALS); INTERFACES (MATERIALS); MAGNESIUM COMPOUNDS; SUBSTRATES; TEMPERATURE;

CORDIERITE; DIELECTRIC THICK FILMS; OXIDIZED COPPER LAYER;

DIELECTRIC FILMS;

EID: 0032636462     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1999.tb02025.x     Document Type: Article

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