|
Volumn 445, Issue , 1997, Pages 313-318
|
Characterization of glass-ceramic dielectric thick films with Cu conductors for multilayer packages
a a a a |
Author keywords
[No Author keywords available]
|
Indexed keywords
ACTIVATION ENERGY;
ALUMINA;
CERAMIC MATERIALS;
COMPOSITION EFFECTS;
COPPER PLATING;
CRYSTALLIZATION;
DISSOLUTION;
GLASS;
MICROSTRUCTURE;
OXIDATION;
THERMAL EXPANSION;
THICK FILMS;
CORDIERITE;
LEAD OXIDE;
DIELECTRIC FILMS;
|
EID: 0031341451
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
|
References (11)
|