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Volumn 445, Issue , 1997, Pages 313-318

Characterization of glass-ceramic dielectric thick films with Cu conductors for multilayer packages

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINA; CERAMIC MATERIALS; COMPOSITION EFFECTS; COPPER PLATING; CRYSTALLIZATION; DISSOLUTION; GLASS; MICROSTRUCTURE; OXIDATION; THERMAL EXPANSION; THICK FILMS;

EID: 0031341451     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (11)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.