Hollow fibres in PCB, MCM-L and PBGA laminates may induce reliability degradation

Circuit World

Volumn 23, Issue 2, 1997, Pages

  Shukla, A ^a   Pecht, M ^a   Jordan, J ^a   Rogers, K ^a   Jennings, D ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FAILURE ANALYSIS; LAMINATED COMPOSITES; MULTICHIP MODULES; PERMITTIVITY; PRINTED CIRCUIT BOARDS; PROTECTIVE COATINGS; RELIABILITY; STRENGTH OF MATERIALS;

CONDUCTIVE FILAMENT FORMATION; E GLASS LAMINATE REINFORCEMENTS; FAILURE MECHANISMS; GLASS FILAMENTS; HOLLOW FIBRES; PLASTIC BALL GRID ARRAYS; WOVEN FABRIC LAMINATES;

GLASS FIBERS;

EID: 0030736201     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)