Hollow fibers in woven laminates

Printed Circuit Fabrication

Volumn 20, Issue 1, 1997, Pages 30-32

  Shukla, Anand A ^a   Dishongh, Terrance J ^a   Pecht, Michael ^a   Jennings, David ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b Collins Commercial Avionics ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COST EFFECTIVENESS; ELECTRONICS PACKAGING; LAMINATES; POLYMERS; RELIABILITY; STABILITY; STRENGTH OF MATERIALS;

BOND STABILITY; CONDUCTIVE FILAMENT FORMATION; HOLLOW FIBERS; WATER RESISTANCE;

GLASS FIBERS;

EID: 0030736418     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (1)

1. Rudra, B. and Pecht, M. "Assessing Time-to-Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates," IEEE Transactions on Components, Packaging and Manufacturing Techniques - Part B, vol. 17(3), 269-276, August 1994.