|
Volumn , Issue , 1997, Pages 348-352
|
Transient analysis of heat transfer in double stack cold plates
|
Author keywords
[No Author keywords available]
|
Indexed keywords
BOUNDARY CONDITIONS;
COOLING SYSTEMS;
ELECTRONICS PACKAGING;
HEAT LOSSES;
MATHEMATICAL MODELS;
SURFACES;
THERMOANALYSIS;
DOUBLE STACK COLD PLATES;
ELECTRONIC COMPONENTS;
ENERGY BALANCE CONDITION;
MONOLITHIC FIN STRUCTURES;
POWER DISSIPATION;
TRANSIENT ANALYSIS;
HEAT TRANSFER;
|
EID: 0030644773
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (1)
|
References (5)
|