Thermal stresses in layered electrical assemblies bonded with solder

Journal of Electronic Packaging, Transactions of the ASME

Volumn 113, Issue 4, 1991, Pages 350-354

  Morgan, H S ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER PROGRAMMING; MATHEMATICAL TECHNIQUES - FINITE ELEMENT METHOD; SOLDERING; STRESSES - THERMAL;

3D MODELING; LAYERED ELECTRICAL ASSEMBLIES;

BONDING;

EID: 0026377583     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905419     Document Type: Article

References (9)

1. Biffle, J. H., 1984, “JAC—A Two-Dimensional Finite Element Computer Program for the Non-Linear Quasistatic Response of Solids with the Conjugate Gradient Method,” SAND81-0998, Sandia National Laboratories, Albuquerque, NM.
2. Biffle, J. H., 1990, “JAC3D—A Three-Dimensional Finite Element Computer Program for the Nonlinear Quasi-Static Response of Solids with the Conjugate Gradient Method,” SAND87-1305, Sandia National Laboratories Albuquerque, NM, to be published.
3. Bourcier, R. J., Frear, D. R., Schmale, D. T., and Karnowsky, M. M., 1988, “Uniaxial Compression Creep Testing of Au-20w/oSn Solder Alloy,” Internal Memorandum, Sandia National Laboratories, Albuquerque, NM.
4. Bourcier, R. J., and Stephens, J. J., 1988, “A Study of Residual Stress and Thermal Fatigue in MC3812 Radar Soldered Assembly, SAND88-0881,” Sandia National Laboratories, Albuquerque, NM.
5. Cook, R. D., 1974, Concepts and Applications of Finite Element Analysis, John Wiley.
6. Jones, R. M., 1975, Mechanics of Composite Materials, McGraw-Hill.
7. Kohl, W. H., 1967, Handbook of Materials and Techniques for Vacuum Devices, Reinhold, New York.
8. Olson, D. R., and Berg, H. M., 1979, “Properties of Die Bonded Alloys Relating to Thermal Fatigue,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-2, No. 2, pp. 257-263.
9. Suhir, E., 1986, “Stresses in Bi-Metal Thermostats,” ASME Journal of Applied Mechanics, Vol. 55, pp. 143-148.