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Volumn 6, Issue , 1999, Pages

Design-oriented substrate noise coupling macromodels for heavily doped CMOS processes

Author keywords

[No Author keywords available]

Indexed keywords

NOISE COUPLING MACROMODELS;

EID: 0032624362     PISSN: 02714310     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (10)

References (11)
  • 1
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    • Computer-aided design considerations for mixed-signal coupling in RF integrated circuits
    • March
    • N. K. Verghese and D. J. Allstot, "Computer-aided design considerations for mixed-signal coupling in RF integrated circuits," IEEE Journal of Solid-State Circuits, vol. 33, no. 3, pp. 314-323, March 1998.
    • (1998) IEEE Journal of Solid-State Circuits , vol.33 , Issue.3 , pp. 314-323
    • Verghese, N.K.1    Allstot, D.J.2
  • 3
    • 0030110592 scopus 로고    scopus 로고
    • Modeling and analysis of substrate coupling in integrated circuits
    • March
    • R. Gharpurey and R. G. Meyer, "Modeling and analysis of substrate coupling in integrated circuits," IEEE Journal of Solid-State Circuits, vol. 31, no. 3, pp. 344-352, March 1996.
    • (1996) IEEE Journal of Solid-State Circuits , vol.31 , Issue.3 , pp. 344-352
    • Gharpurey, R.1    Meyer, R.G.2
  • 4
    • 0027576336 scopus 로고
    • Experimental results and modeling techniques for substrate noise in mixed-signal in-tegrated circuits
    • April
    • D. K. Su, M. J. Loinaz, S. Masui and B. A. Wooley, "Experimental results and modeling techniques for substrate noise in mixed-signal in-tegrated circuits," IEEE Journal of Solid-State Circuits, vol. 28, no. 4, pp. 420-430, April 1993.
    • (1993) IEEE Journal of Solid-State Circuits , vol.28 , Issue.4 , pp. 420-430
    • Su, D.K.1    Loinaz, M.J.2    Masui, S.3    Wooley, B.A.4
  • 5
    • 0001431369 scopus 로고    scopus 로고
    • Modeling and measurement of substrate coupling in Si-Bipolar IC's up to 40GHz
    • April
    • M. Pfost and H. Rein, "Modeling and measurement of substrate coupling in Si-Bipolar IC's up to 40GHz," IEEE Journal of Solid-State Circuits, vol. 33, no. 4, pp. 582-591, April 1998.
    • (1998) IEEE Journal of Solid-State Circuits , vol.33 , Issue.4 , pp. 582-591
    • Pfost, M.1    Rein, H.2
  • 6
    • 0030110603 scopus 로고    scopus 로고
    • Verification techniques for substrate coupling and their applications to mixed-signal IC design
    • March
    • N. K. Verghese, D. J. Allstot and M. A. Wolfe, "Verification techniques for substrate coupling and their applications to mixed-signal IC design" IEEE Journal of Solid State Circuits, vol. 31, no. 3, pp. 354-365, March 1996.
    • (1996) IEEE Journal of Solid State Circuits , vol.31 , Issue.3 , pp. 354-365
    • Verghese, N.K.1    Allstot, D.J.2    Wolfe, M.A.3
  • 7
    • 0028384192 scopus 로고
    • Addressing substrate coupling in mixed-Mode IC's and power distribution synthesis
    • March
    • B. R, Stanisic, N. K. Verghese, R. A. Rutenbar, R. L. Carley and D.J. Allstot, "Addressing substrate coupling in mixed-Mode IC's and power distribution synthesis," IEEE Journal of Solid-State Circuits, vol. 29, no. 3 pp. 226-237, March 1994.
    • (1994) IEEE Journal of Solid-State Circuits , vol.29 , Issue.3 , pp. 226-237
    • Verghese, N.K.1    Rutenbar, R.A.2    Carley, R.L.3    Allstot, D.J.4
  • 8
    • 0342886934 scopus 로고
    • Resonant forward-biased guard-ring diodes for suppression of substrate noise in mixed-mode CMOS circuits
    • April
    • L. Forbes, B. Ficq and S. Savage, "Resonant forward-biased guard-ring diodes for suppression of substrate noise in mixed-mode CMOS circuits," Electronics Letters, vol. 31, no. 9, pp. 720-721, April 1995.
    • (1995) Electronics Letters , vol.31 , Issue.9 , pp. 720-721
    • Forbes, L.1    Ficq, B.2    Savage, S.3
  • 9
    • 0029237866 scopus 로고
    • Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures
    • June
    • L. M. Silveira, M. Kamon and J. White, "Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures," IEEE/ACM Proc. DAC, June 1995, pp. 376-380.
    • (1995) IEEE/ACM Proc. DAC , pp. 376-380
    • Silveira, L.M.1    Kamon, M.2    White, J.3
  • 11
    • 0004171456 scopus 로고    scopus 로고
    • TMA MEDICI, Technology Modeling Associates, Inc., Palo Alto, CA, Version 3.3, Feb
    • TMA MEDICI, "Two-dimensional device simulation program," Technology Modeling Associates, Inc., Palo Alto, CA, Version 3.3, Feb. 1997.
    • (1997) Two-dimensional Device Simulation Program


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.