Using MMIC flip chips and CVD diamond for improved thermal management of microwave modules

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 505-507

  Sturdivant, Rick ^a   Ly, Chung ^a   Benson, Joe ^a   Wooldridge, John ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; FLIP CHIP DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SUBSTRATES; SYNTHETIC DIAMONDS; THERMAL CONDUCTIVITY OF SOLIDS;

MICROWAVE MODULES; THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0030655397     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)