RTP requirements to yield uniform and repeatable ultra-shallow junctions with low energy boron and BF2 ion implants

Journal of Electronic Materials

Volumn 27, Issue 12, 1998, Pages 1291-1295

  Marcus, Steven ^a   Lerch, Wilfried ^b   Downey, Daniel F ^c   Todorov, Stanislov ^c   Chow, Judy ^c  

^a STEAG AST Elektronik   (United States)

^b STEAG AG   (Germany)

^c VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES   (United States)

Author keywords

Boron shallow junctions; Ion implants; Rapid thermal processing (RTP); Sheet resistance

Indexed keywords

BORON COMPOUNDS; ION IMPLANTATION; OXYGEN SENSORS; RAPID THERMAL ANNEALING; SEMICONDUCTING BORON;

SHEET RESISTANCE;

SEMICONDUCTOR JUNCTIONS;

EID: 0032300598     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0088-1     Document Type: Article

References (18)

1. D.F. Downey, C.M. Osbura and S. Marcus, Solid State Technol. 71, Dec. (1997).
2. C.M. Osburn, D.F. Downey, S.B. Felch and B.S. Lee, Proc. 11th Intl. Conf. on Ion Implantation Technology, (1997), p. 607.
3. S.B. Felch, B.S. Lee, D.F. Downey, Z. Zhao and R. Eddy, Proc. 11th Intl. Conf. on Ion Implantation Technology, (1997), p. 611.
4. S.L. Daryanani, D.F. Downey, J.J. Cummings, M. Meloni, C. McKenna and Z. Nényei, European Semiconductor Magazine April (1997).
5. D.F. Downey, S.L. Daryanani, M. Meloni, K. Brown, S.B. Felch, B.S. Lee, S. Marcus and J. Gelpey, presented at the Materials Research Society Symp., Rapid Thermal and Integrated Processing Session, April, 1997.
6. W. Harrington, C. Magee, M. Pawlik, D.F. Downey, C.M. Osburn and S.B. Felch, Proc. Fourth Intl. Workshop on Ultrashallow Junctions, April 1997, p. 7.1.
7. C. Magee, J. Shallenberger, M. Denker, D.F. Downey, M. Meloni, S. Cloherty, S.B. Felch and B.S. Lee, Proc. Fourth Intl. Workshop on Ultrashallow Junctions, April 1997, p. 8.1.
8. D.F. Downey, C.M. Osburn, J. Cummings, S.L. Daryanani and S. Falk, presented at the Intl. Conf. on Metallurgical Coatings and Thin Films, April 1997.
9. S. Marcus, D.F. Downey, S.L. Daryanani and J. Chow, presented at RTF '97, 5th Intl. Conf. on Advanced Thermal Processing of Semiconductors, September 1997.
10. S. Todorov, D.F. Downey, S.L. Daryanani, J. Chow, M. Meloni and S. Marcus, presented at RTP '97, 5th Intl. Conf. on Advanced Thermal Processing of Semiconductors, September 1997.
11. D.F. Downey, U.S. patent pending application (1998).
12. D.F. Downey, J.W. Chow, W. Lerch, J. Neiss and S.D. Marcus, presented at MRS April 1998, and MRS RTP Proc. (Pittsburgh, PA: Mater. Res. Soc.).
13. H. Walk and T. Theiler, 2nd Intl. Conf. on Advanced Thermal Processing of Semiconductors, RTP '94, eds. R.B. Fair and B. Lojek.
14. Z. Nényei, et al., 3rd Intl. Conf. on Advanced Thermal Processing of Semiconductors, RTP '95, eds. R.B. Fair and B. Lojek.
15. T. Riley, R. Bremensdorfer and S.D. Marcus, Mater. Res. Soc. Symp. Proc. 470, (Pittsburgh, PA: Mater. Res. Soc., 1997), p. 35.
16. C.M. Osburn, Rapid Thermal Processing Science and Technology, ed. R.B. Fair, (Boston, MA: Academic Press, 1993), p. 257.
17. Z. Nényei, H. Sommer, J. Gelpey and A. Bauer, Mater. Res. Soc. Symp. Proc., 342, (Pittsburgh, PA: Mater. Res. Soc., 1994), p. 401.
18. U.S. patent 5,580,830.