Wafer emissivity independent temperature measurements

Journal of Electronic Materials

Volumn 27, Issue 12, 1998, Pages 1323-1328

  Abedrabbo, S ^a   Tong, F M ^a   Ravindra, N M ^a   Gelpey, J ^b   Marcus, S ^b   Fiory, A T ^c  

^a NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

^b Steag AST Electronik USA Inc   (United States)

^c LUCENT TECHNOLOGIES   (United States)

Author keywords

Emissivity; Hotliner; Pyrometer; Si

Indexed keywords

COMPUTER SIMULATION; LIGHT EMISSION; PYROMETERS; RAPID THERMAL ANNEALING; TEMPERATURE MEASUREMENT;

SPECTRAL EMISSOMETERS;

SILICON WAFERS;

EID: 0032290679     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0091-6     Document Type: Article

References (22)

1. P.J. Timans, Advances in Rapid Thermal and Integrated Processing, ed. F. Roozeboom, (Dordrecht, The Netherlands: Kluwer Academic Publishers, 1996), chap. 2, p. 35.
2. K. Sato, Jpn. J. Appl. Phys. 6 (3), 339 (1967).
3. P. Vandenabeele and K. Maex, J. Appl. Phys. 72, 5867 (1992).
4. S. Abedrabbo, J.C. Hensel, O.H. Gokce, F.M. Tong, B. Sopori, A.T. Fiory and N.M. Ravindra, Mater. Res. Soc. Proc., Spring (Pittsburgh, PA: Mater. Res. Soc., 1998), in press.
5. F. Roozeboom, Advances in Rapid Thermal and Integrated Processing, ed. F. Roozeboom, (Dordrecht, The Netherlands: Kluwer Academic Publishers, 1995), chap. 1, p. 1.
6. N.M. Ravindra., F.M. Tong, W. Schmidt, W. Chen, S. Abedrabbo, A. Nanda, T. Speranza and A.M. Tello, ISSM '96, Proc. Fifth Intl. Symp. on Semiconductor Manufacturing, Tokyo, Japan, October, (1996). p. 101.
7. J.R. Markham et al., Review Scientific Instruments 64 (9), 2515 (1993).
8. M. Born and E. Wolf, Principles of Optics, Fourth Ed., (Pergamon Press, 1970), chap. 8, p. 381.
9. K.D. Moeller, Optics, in press, chap. 5.
10. F. Roozeboom, Rapid Thermal Processing Science and Technology, ed. R.B. Fair, (New York: Academic Press, Inc., 1993), p. 349.
11. J.M. Palmer, Handbook of Optics, Vol. II, ed. M. Bass, (1995), chap. 25, p. 8.
12. N.M. Ravindra, S. Abedrabbo, W. Chen, F.M. Tong, A.K. Nanda and T. Speranza, IEEE Trans. on Semiconductor Manu. 11 (1), 30 (1998).
13. R.A. Smith, Semiconductors, (Cambridge, England: Cambridge University Press, Cambridge, 1961), p. 216.
14. D.K. Schroder, R. Noel Thomas and J.C. Swartz, IEEE J. Solid-State Circuits SC-13, (1), Feb. (1978).
15. S. Abedrabbo, Ph.D. Dissertation, New Jersey Institute of Technology, August (1998).
16. S. Abedrabbo, J.C. Hensel, A.T. Fiory, B. Sopori, W. Chen and N.M. Ravindra, Materials Science in Semiconductor Processing, (in press).
17. H.F. Wolf, Semiconductors, (New York: John Wiley & Sons, 1971), p. 59.
18. T.J. Riley, R. Bremensdorfer and S. Marcus, Proc. MRS '97, April, (Pittsburgh, PA: Mater. Res. Soc., 1997), p. 35.
19. N. M. Ravindra et al., Fourth Intl. Conf. on Rapid Thermal Processing, Boise, Idaho, September, (1996), p. 190.
20. S. Abedrabbo, N.M. Ravindra, W. Chen, V. Rajasekhar, T. Golota, O.H. Gokce, A.T. Fiory, B. Nguyenphu, A. Nanda, T. Speranza, W. Maszara and G. Williamson, Proc. Materials Research Society, April (Pittsburgh, PA: Mater. Res. Soc., 1997).
21. P.J. Timans, Solid State Technol. 40 (4), 63 (1997).
22. Z. Atzmon, Z. Doitel, A. Harnik, S. Levi, A. Thon, P. Alezra and H. Gilboa, Fifth Intl. Conf. on Rapid Thermal Processing, Louisiana, New Orleans, September, (1997), p. 114.