Plasma etching of dielectric films with novel iodofluorocarbon chemistries: Iodotrifluoroethylene and 1-iodoheptafluoropropane

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 2, 1998, Pages 755-758

  Karecki, S M ^a   Pruette, L C ^a   Reif, R ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0032390649     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581103     Document Type: Article

References (4)

1. S. Solomon, J. B. Burkholder, A. R. Ravishankara, and R. R. Garcia, J. Geophys. Res. 99, 20 929 (1994).
2. Intergovernmental Panel on Climate Change (IPCC), Radiative Forcing of Climate Change - The 1994 Working Report of the Scientific Assessment Working Group of IPCC (University of Cambridge, Cambridge, 1994).
3. S. M. Karecki, L. C. Pruette, and L. R. Reif, Proceedings of the Materials Research Society, Symposium Proceedings 447: Environmental, Safety, and Health Issues in IC Production, 67 (1997).
4. 8 Etch Process Development Report, Novellus Systems, Inc. 1995 (unpublished).