Materials issues for solutions of power electronic building blocks (PEBB)

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 177-178

  Lostetter, A ^a   Webster, J ^a   Hoagland, R ^a   Barlow, Fred D ^a   Elshabini Riad, Aicha ^a   Nelson, Douglas ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CERAMIC MATERIALS; DIELECTRIC FILMS; ELECTRIC BREAKDOWN; ELECTRONICS PACKAGING; METALLIC FILMS; METALLIZING; MULTICHIP MODULES; POWER ELECTRONICS; SUBSTRATES;

ARCING; DIRECT METAL ATTACHMENT; POLYMER DIELECTRICS; POWER ELECTRONIC BUILDING BLOCKS; POWER SIGNAL LAYERS; THERMAL MANAGEMENT;

METALLIC MATRIX COMPOSITES;

EID: 0030713510     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)