Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1164-1171

  So, Alex C K ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ANNEALING; INTERFACES (MATERIALS); LEAD ALLOYS; SEMICONDUCTOR GROWTH; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; THICK FILMS; TIN ALLOYS;

COMPONENT METALLIZATION; EUTECTIC SOLDERS; ISOTHERMAL AGING; METALLIZATION; SOLID STATE GROWTH; SURFACE MOUNT SOLDER JOINTS;

INTERMETALLICS;

EID: 0029698881     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (20)