Transmission electron microscope specimen preparation of Zn powders using the focused ion beam lift-out technique

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 29, Issue 9, 1998, Pages 2399-2406

  Prenitzer, B I ^a,f   Giannuzzi, L A ^b   Newman, K ^c   Brown, S R ^d   Irwin, R B ^e   Shofner, T L ^f   Stevie, F A ^f  

^a Graduate Research Assistant   (United States)

^b University of Central Florida ^*

^c University of Central Florida   (United States)

^d Keystone Powdered Metal Company   (United States)

^e Cirent Semiconductor   (United States)

^f Bartech   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN SIZE AND SHAPE; ION BEAMS; METALLOGRAPHIC MICROSTRUCTURE; OPTICAL MICROSCOPY; POWDER METALS; SCANNING ELECTRON MICROSCOPY; SPECIMEN PREPARATION; TRANSMISSION ELECTRON MICROSCOPY;

FOCUSED ION BEAM LIFT-OUT TECHNIQUE;

ZINC;

EID: 0032162412     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-998-0116-z     Document Type: Article

References (37)

1. Randall M. German: .Powder Metallurgy Science, 2nd ed., Metal Powder Industries Federation, Princeton, NJ, 1994, pp. 16-25.
2. Donald G. White: Des. Nws, 1996, vol. 51, p. 102.
3. Donald G. White: Mach. Des., 1994, vol. 66.
4. Thomas B. Gurganus: Adv. Mater. Processes, 1995, vol. 148, pp. 5759.
5. David T. Gethen, Viel D. Tran, and Roland W. Lewis:/ J. Powder Metall, 1994, vol. 30, pp. 385-98.
6. Animesh Bose: Int. J. Powder Metall., 1995, vol. 47, pp. 26-30.
7. Reginald L. Eadie and Xiolin Chen: Int. J. Powder Metall., 1996, No. 3, pp. 265-75.
8. David B. Williams and Barry Carter: Transmission Electron Microscopy, Plenun Press, New York, NY, 1996, pp. 163-64.
9. Manfred Von Heimendahl: Electron Microscopy of Materials, An Introduction, Academic Press, Inc., San Diego, CA, 1980, pp. 89-91.
10. J.A. Yater and M.O. Thompson: J. Vac. Sci. Technol. B, 1992, vol. 10 (1), pp. 183-86.
11. C.E. Sanborn and S.A. Myers: Materials Research Society Symp. on Specimen Preparation for Transmission Electron Microscopy of Materials-III, American Institute of Physics, College Park, MD, 1992, vol. 254, pp. 239-248.
12. M.H.F. Overwijk, F.C. van den Heuvel, and C.W.T. Bule-Lieuwma: J. Vac. Sci. Technol. B, 1993, vol. 11 (6), pp. 2021-24.
13. M. Tartuani, Y. Takai, R. Shimizu, K. Uda, and H. Takahashi: Tech. Rep. Osaka Univ., 1993, vol. 43 (2143), pp. 167-73.
14. M.L. Thayer: ISTFA '93, Proc. 19th Int. Symp. on Testing Failure Analysis, ASM International, Materials Park, OH, 1993, pp. 425-29.
15. T. Ishitani, H. Tsuboi, T. Yaguchi, and H. Koike: J. Electron Microsc., 1994, vol. 43, pp. 322-26.
16. F.A. Stevie, T.C. Shane, P.M. Kahora, R. Hull, D. Bahnck, V.C. Kanna, and E. David: Surf. Interface Anal., 1995, vol. 23, pp. 61-68.
17. Y. Kitano, Y. Fujikawa, T. Kamino, T. Yaguchi, and H. Saka: J. Electron Microsc., 1995, vol. 44, pp. 410-13.
18. L.A. Giannuzzi, J.L. Drown, S.R. Brown, R.B. Irwin, and F.A. Stevie: Microsc. Res. Technol, Wiley-Liss, Inc., vol. 41, 1998, pp. 285-90.
19. L.A. Giannuzzi, J.L. Drown, S.R. Brown, R.B. Irwin, and F.A. Stevie: Workshop on Specimen Preparation for TEM of Materials IV, Materials Research Society Symposia Proceedings, Materials Research Society, Pittsburgh, PA, 1997, pp. 19-27.
20. R. Noone: Euro ASIC '92, Proc. Euro ASIC 92, 1992, IEEE Service Center, Piscataway, NJ, pp. 414-15.
21. H. Mendez, S. Morris, S. Tatti, N. Dickson, and R.E. Pyle: SPIEProc. Microelectronics Manufacturing and Reliability, 1992, vol. 1802, pp. 126-33.
22. F.C. van den Heuvel, M.H.F. Overwijk, E.M. Fleuren, H. Laisina, and K.J. Sauer: Microelectron. Eng., 1993, vol. 21, pp. 209-12.
23. A.B. Soto and S.L. Riley: ISTFA '93, Proc. 19th Int. Symp. on Testing Failure Analysis, ASM International, Materials Park, OH, 1993, pp. 419-24.
24. K. Van Doorselaer, M. Van den Reeck, L. Van den Bempt, R. Young, and J. Whitney: ISTFA '93, Proc. 19th Int. Symp. on Testing Failure Analysis, ASM International, Materials Park, OH, 1993, pp. 405-15.
25. K. Van Doorselaer and L. Van den Bempt: ISTFA '94, Proc. 20th Int. Symp. on Testing Failure Analysis, ASM International, Materials Park, OH, 1994, pp. 397-405.
26. S.X. Li, D. Lee, and S. Leung: ISTFA '94, Proc. 20th Int. Symp. on Testing Failure Analysis, ASM International, Materials Park, OH, 1994, pp. 415-19.
27. J.M. Chabala, R. Levi-Setti, and Y.L. Wang: J. Vac. Sei Technol. B, 1988, vol. 6 (3), pp. 910-14.
28. D.E. Newbury: Microbeam Analysis, San Francisco Press, Inc., San Francisco, CA, 1988, pp. 93-101.
29. C.H. Chu, Y.F. Hseih, L.R. Harriot, and H.H. Wade: J. Vac. Sei Technol. B, 1991; vol. 9 (6), pp. 3451-55.
30. M-Bond 600 Adhesive Manufacturer's Literature, M-Line Accessories, Measurements Group, Inc., Raleigh, NC.
31. Randall M. German: Powder Metallurgy Science, 2nd ed., Metal Powder Industries Federation, Princeton, NJ, I994, pp. 100-06.
32. T. Ishitani, K. Umemura, Y. Kawanami, and T. Ohnishi: J. Electrochem. Soc., 1989, vol. 136 (11), pp. 3502-05.
33. M.H.F. Overwijk and F.C. van den Heuvel: Nucl. Instrum. Methods Phys. Res., 1993, sect. B, vol. 80, pp. 1324-27.
34. H. Yamaguchi, A. Shimase, S. Haraaichi, and T. Miyauchi: J. Vac. Sci. Technol. B, 1985, vol. 3, pp. 71-74.
35. FEI Focused Ion Beam Application Note, High Aspect Ratio Hole Drilling Using FIB Enhanced Etch Process, 1993.
36. J.F. Walker: Unpublished research.
37. L.A. Giannuzzi: Ph.D. Thesis, The Pennsylvania State University, University Park, PA, 1992.