Adhesion characterization of titanium and titanium nitride thin coatings on metals using the scratch test

International Journal of Adhesion and Adhesives

Volumn 15, Issue 3, 1995, Pages 191-196

  Nsongo, T ^a   Gillet, M ^a  

^a ERS 14 CNRS   (France)

Author keywords

coating substrate adhesion; physical chemical bonding; scratch test

Indexed keywords

BONDING; CHEMICAL BONDS; COATINGS; LATTICE CONSTANTS; MAGNETRON SPUTTERING; MATHEMATICAL MODELS; METALS; SPUTTER DEPOSITION; THIN FILMS; TITANIUM; TITANIUM NITRIDE; VAN DER WAALS FORCES;

ADHESION ENERGY; D.C. TRIODE SPUTTERING; SCRATCH TEST; THIN COATINGS;

ADHESION;

EID: 0029344783     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/0143-7496(95)91631-F     Document Type: Article

References (34)

1. TiN formed by evaporation as a diffusion barrier between Al and Si
2. Color of titanium nitride prepared by reactive dc magnetron sputtering
3. The effect of oxygen and substrate temperature on the growth of Ti thin films on stainless-steel substrates
4. Some factors influencing the adhesion of films produced by vacuum evaporation
5. Measurement of Adhesion of Thin Films
6. Adhesion of thin films
7. Diffusion in gold-aluminium
8. The Stress Field Created by a Circular Sliding Contact
9. Internal Stress of Evaporated Thin Gold Films