Low cost packaging of semiconductor laser arrays using passive self-aligned flip-chip technique on Si motherboard

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 8-12

  Hunziker, W ^a   Vogt, W ^a   Melchior, H ^a   Germann, R ^a   Harder, C ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT TRENCHES; COUPLING EFFICIENCY; LASER ARRAY MODULES; MULTIMODE FIBER RIBBONS; PASSIVE SELF ALIGNED PACKAGING; SILICON MOTHERBOARD;

ELECTRIC CURRENTS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; OPTICAL FIBER COUPLING; PRINTED CIRCUIT BOARDS; SEMICONDUCTING SILICON; SEMICONDUCTOR LASERS;

ELECTRONICS PACKAGING;

EID: 0029717950     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (19)