A new bonding technique for microwave devices

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 57-62

  Dohle, G Rainer ^a   Callahan, John J ^a   Martin, Kevin P ^a   Drabik, Timothy J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Bonding; Epitaxial lift off; Gold tin; Microwave and optoelectronic devices

Indexed keywords

BONDING; GOLD ALLOYS; INTEGRATED OPTOELECTRONICS; LATTICE CONSTANTS; MILLIMETER WAVE DEVICES; MULTILAYERS; OPTICAL MICROSCOPY; OPTOELECTRONIC DEVICES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SUBSTRATES; X RAY ANALYSIS;

DIELECTRIC PLANARIZATION TECHNIQUES; ENERGY DISPERSIVE X RAY ANALYSIS; EPITAXIAL LIFT OFF DEVICES; MICROWAVE FREQUENCIES; STANDARD SURFACE ANALYSIS TECHNIQUES; VAN DER WAALS BONDING;

MICROWAVE DEVICES;

EID: 0030082458     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486485     Document Type: Article

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